The arrival of a new laser machine at Binder provides flexibility in 3D machining
Binder is perfectly equipped with the new TruLaser Cell 7040. A significant increase in production speed is now possible due to increased machine dynamics and numerous cycle optimization functions. As a result of the new laser machine, Binder can adjust to changing production environments seamlessly and react quickly to customer requirements. The seamline system enables optimal welding control.
Modern control system:
The Siemens 840 D provides a stable and rapid execution of both precise and intricate work steps.
Applications include the production of low-oxide weld seams, even in 5-axis simultaneous operation. Due to the greater flexibility of the welding optics and high welding performance, Binder can reliably process a larger range of material thicknesses.
Data and equipment TRUMPF 7040 with Tru Disk 5001
Working area | 4000 x 1500 x 1000 |
Additional A-axis | On foundation, big |
Probe | Renishaw |
Seam tracking | Seamline System |
Cutting gas option | Argon |
Cutting optics | dynamic |
Cutting gap | from about 0,16mm |
Welding optics | MS0 100 |
Wire feed | Binzel |
Control | Siemens 840 D |
Prozesskamera | Coaxial in MSO |
Process camera | Controlline |
Laser | Tru Disk 5001 – 5kW |